Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/053486
Kind Code:
A1
Abstract:
This semiconductor device comprises: a chip having a first main surface on one side and a second main surface on the other side; a first terminal that is disposed on the first main surface; a second terminal that is disposed on the second main surface; and a protection circuit that includes a protection transistor formed on the first main surface so as to be electrically interposed between the first terminal and the second terminal, and that forms a discharge path for overvoltage generated between the first terminal and the second terminal. The protection transistor includes a plurality of trench gate structures each having an upper electrode and a lower electrode buried in the vertical direction sandwiching an insulator inside a trench formed in the first main surface.
Inventors:
OSUMI YUJI (JP)
Application Number:
PCT/JP2023/031228
Publication Date:
March 14, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L29/78; H01L29/12
Foreign References:
| JP2020072158A | 2020-05-07 | |||
| JP2019054071A | 2019-04-04 | |||
| JP2021044578A | 2021-03-18 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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