Title:
SEMICONDUCTOR DIE ENCAPSULATION OR CARRIER-MOUNTING METHOD, AND CORRESPONDING SEMICONDUCTOR DIE ENCAPSULATION OR CARRIER-MOUNTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2014/123413
Kind Code:
A1
Abstract:
A semiconductor die encapsulation or carrier-mounting method comprises the steps of providing a first tool part for holding multiple semiconductor dies and providing the semiconductor dies on the first tool part; providing a second tool part, one of the first and second tool parts comprising displaceable insert members to allow applying a pressure by each displaceable insert member on a surface area of a semiconductor die; and bringing together the first and second tool parts such as to define a space between the first and second tool parts, the semiconductor products being arranged in the space. The displaceable insert members apply a pressure onto the surface area of the semiconductor dies. The pressure applied by the displaceable insert members is monitored and regulated to a predetermined pressure. Subsequently, the first and second tool parts are separated and the processed semiconductor dies are removed.
Inventors:
DE BEIJER JOHANNES CORNELIS (NL)
RUTTEN MICHIEL HENDRIKUS ANTONIUS WILHELMUS (NL)
HUIZING GER (NL)
HOEDEMAKER MIKE LOUIS THEODOOR (NL)
RUTTEN MICHIEL HENDRIKUS ANTONIUS WILHELMUS (NL)
HUIZING GER (NL)
HOEDEMAKER MIKE LOUIS THEODOOR (NL)
Application Number:
PCT/NL2014/050069
Publication Date:
August 14, 2014
Filing Date:
February 05, 2014
Export Citation:
Assignee:
BOSCHMAN TECHNOLOGIES BV (NL)
International Classes:
B29C45/02; H01L21/67
Domestic Patent References:
| WO2007150012A2 | 2007-12-27 | |||
| WO2007150012A2 | 2007-12-27 |
Foreign References:
| GB2253182A | 1992-09-02 | |||
| EP1939926A1 | 2008-07-02 |
Attorney, Agent or Firm:
NEDERLANDSCH OCTROOIBUREAU (JS The Hague, NL)
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