Title:
SEMICONDUCTOR DIE PICKUP APPARATUS AND SEMICONDUCTOR DIE PICKUP METHOD
Document Type and Number:
WIPO Patent Application WO/2010/001497
Kind Code:
A1
Abstract:
A semiconductor die pickup apparatus is provided with a stage (20) including an adhering surface (22) to be adhered to a holding sheet (12); a suction opening (41) arranged on the adhering surface (22); a cover (23) which slides along the adhering surface (22) and opens/closes the suction opening (41); and a collet (18) for sucking a semiconductor die (15). At the time of picking up the semiconductor die (15), a leading end (23a) of the cover (23) is advanced from the adhering surface (22), and the cover (23) is slid while pressing up the holding sheet (12) and the semiconductor die (15) to successively open the suction hole (41). The holding sheet (12) is successively sucked by the opened suction opening (41) to successively pull and remove the holding sheet (12) from the semiconductor die (15), and at the same time, a collet (18) waiting directly above the semiconductor (15) is made to successively suck the semiconductor dies (15) to pickup the semiconductor dies (15). Thus, the semiconductor die pickup device easily picks up the semiconductor die while suppressing a force applied to the semiconductor die at the time of pulling and removing the holding sheet.
Inventors:
UMEHARA OKITO (JP)
SASAKI SHINICHI (JP)
SASAKI SHINICHI (JP)
Application Number:
PCT/JP2008/064516
Publication Date:
January 07, 2010
Filing Date:
August 13, 2008
Export Citation:
Assignee:
SHINKAWA KK (JP)
UMEHARA OKITO (JP)
SASAKI SHINICHI (JP)
UMEHARA OKITO (JP)
SASAKI SHINICHI (JP)
International Classes:
H01L21/52; H01L21/60; H01L21/67
Foreign References:
| JP2005197368A | 2005-07-21 | |||
| JP2004327965A | 2004-11-18 | |||
| JP2003264203A | 2003-09-19 | |||
| JP2005328054A | 2005-11-24 | |||
| JP2003224088A | 2003-08-08 |
Attorney, Agent or Firm:
YOSHIDA, Kenji et al. (JP)
Kenji Yoshida (JP)
Kenji Yoshida (JP)
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