Title:
SEMICONDUCTOR DIE PICKUP APPARATUS AND SEMICONDUCTOR DIE PICKUP METHOD
Document Type and Number:
WIPO Patent Application WO/2015/125385
Kind Code:
A1
Abstract:
The present invention is provided with: a stage (20) including a suction surface (22) for sucking a dicing sheet (12); a suction opening (40) that is provided in the suction surface (22) of the stage (20); a cover (23) that opens/closes the suction opening (40) by sliding along the suction surface (22); and an opening pressure switching mechanism (80) that switches pressure of the suction opening (40) between a first pressure (P1) that is close to vacuum, and second pressure (P2) close to atmosphere. At the time of picking up a semiconductor die (15), each time the pressure of the suction opening (40) is switched to the second pressure (P2) from the first pressure (P1), the cover (23) is slid a predetermined distance in the opening direction. Consequently, generation of breakage of the semiconductor die is suppressed, and the semiconductor die is effectively picked up.
Inventors:
NAGANO KAZUAKI (JP)
KATAYAMA YOSHIFUMI (JP)
TOYODA HIROKI (JP)
ISHIZUKA TAKESHI (JP)
FUKUMOTO SHINSUKE (JP)
KATAYAMA YOSHIFUMI (JP)
TOYODA HIROKI (JP)
ISHIZUKA TAKESHI (JP)
FUKUMOTO SHINSUKE (JP)
Application Number:
PCT/JP2014/082965
Publication Date:
August 27, 2015
Filing Date:
December 12, 2014
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/67; H01L21/52
Foreign References:
| JP2010206036A | 2010-09-16 | |||
| JP2012156517A | 2012-08-16 | |||
| JP2012074491A | 2012-04-12 | |||
| JP2010010519A | 2010-01-14 | |||
| US20090075459A1 | 2009-03-19 | |||
| JP2004226250A | 2004-08-12 | |||
| US20080092360A1 | 2008-04-24 | |||
| US20100252205A1 | 2010-10-07 |
Attorney, Agent or Firm:
YKI Patent Attorneys (JP)
Patent business corporation YKI international patent firm (JP)
Patent business corporation YKI international patent firm (JP)
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