Title:
SEMICONDUCTOR ELEMENT BONDED BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2018/173394
Kind Code:
A1
Abstract:
This semiconductor element bonded body has: a substrate that is provided with a recessed section; and a semiconductor element mounted on the substrate, said semiconductor element being disposed in the recessed section. A substrate portion where the recessed section is provided is formed of Cu. The height d of a step formed in the outer peripheral portion of the recessed section is equal to or more than 20 [μm] but less than 50 [μm]. When the wavelength λ of a laser beam is 632.8 [nm], the planarity of the bottom surface of the recessed section is λ/8.7-λ/1.2 [μm]. The semiconductor element is provided with a metal film. The bottom surface of the recessed section and the metal film are directly bonded to each other.
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WO/2019/216052 | SEMICONDUCTOR DEVICE |
WO/2020/090957 | ELECTRONIC COMPONENT MOUNTING APPARATUS |
Inventors:
YAMAZAKI KOJI (JP)
KATO TOMOAKI (JP)
KATO TOMOAKI (JP)
Application Number:
PCT/JP2017/045812
Publication Date:
September 27, 2018
Filing Date:
December 20, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/52; B23K20/00; H01L23/12; H01L23/48
Domestic Patent References:
WO2013141149A1 | 2013-09-26 |
Foreign References:
JP2014053384A | 2014-03-20 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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