SEMICONDUCTOR ELEMENT MANUFACTURING DEVICE AND SEMICONDUCTOR ELEMENT MANUFACTURING METHOD

WIPO Patent Application WO/2019/017489

A1

The present invention provides a semiconductor element manufacturing device and a semiconductor element manufacturing method that have an efficient static elimination effect, and exhibit excellent cleanliness and chemical resistance. This semiconductor element manufacturing device includes: a stage that is equipped with a chuck pin and/or a wafer pin, and is used for holding a semiconductor wafer; and a nozzle that is used for supplying a washing solution, etching solution, or resist solution. The nozzle is a resin molded body that includes a composite resin material including carbon nanotubes and at least one fluororesin, and/or at least one selected from the chuck pin, the wafer pin, and the stage is a resin molded body that includes a composite resin material including carbon nanotubes and at least one fluororesin.

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YAMAMOTO HIROKAZU (JP)
ITAMI HIROTAKA (JP)
NOGUCHI ISAMU (JP)
TSUKAMOTO TADAKAZU (JP)
KAWATO SUSUMU (JP)

PCT/JP2018/027360

January 24, 2019

July 20, 2018

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TOHO KASEI CO LTD (JP)

H01L21/304; C08L27/12; H01L21/027; H05F1/00

JP2008159789A	2008-07-10
JP2013093407A	2013-05-16
JP2004304138A	2004-10-28
JP2006286947A	2006-10-19
JP2014241390A	2014-12-25
JP2009295751A	2009-12-17
JP2017075674A	2017-04-20
JP2008004762A	2008-01-10

YAMAO, Norihito et al. (JP)

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