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Patent Searching and Data


Title:
SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2012/014448
Kind Code:
A1
Abstract:
Provided are a semiconductor element and a method for producing a semiconductor element, wherein no cracks of a compound semiconductor layer occur due to the internal stress of the compound semiconductor layer during lift-off. Specifically provided is a method for producing a semiconductor element that has a configuration wherein a semiconductor layer is bonded to a supporting substrate (30). The method for producing a semiconductor element comprises: an element region formation step wherein an element region (15a) that is composed of the semiconductor layer is formed on a growth substrate (11) with a lift-off layer (12) interposed therebetween; a columnar member formation step wherein a columnar member (21) is formed on the growth substrate; a bonding step wherein the upper parts of the semiconductor layer and the columnar member are bonded to the supporting substrate; a lift off step wherein the lower surface of the semiconductor layer and the growth substrate are separated from each other by removing the lift-off layer without separating the columnar member from the growth layer; and a step wherein the columnar member is separated from the supporting substrate.

Inventors:
KADOWAKI, Yoshitaka (4-14-1, Sotokanda, Chiyoda-k, Tokyo 21, 〒1010021, JP)
門脇 嘉孝 (〒21 東京都千代田区外神田四丁目14番1号 DOWAエレクトロニクス株式会社内 Tokyo, 〒1010021, JP)
Application Number:
JP2011/004209
Publication Date:
February 02, 2012
Filing Date:
July 26, 2011
Export Citation:
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Assignee:
DOWA Electronics Materials Co., Ltd. (4-14-1, Sotokanda Chiyoda-k, Tokyo 21, 〒1010021, JP)
DOWAエレクトロニクス株式会社 (〒21 東京都千代田区外神田四丁目14番1号 Tokyo, 〒1010021, JP)
KADOWAKI, Yoshitaka (4-14-1, Sotokanda, Chiyoda-k, Tokyo 21, 〒1010021, JP)
International Classes:
H01L33/32; H01S5/323
Attorney, Agent or Firm:
HORI, Shiroyuki et al. (1F Shoyu-kaikan Bldg, 3-3-1 Kasumigaseki, Chiyoda-k, Tokyo 13, 〒1000013, JP)
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Claims: