Title:
SEMICONDUCTOR ELEMENT-MOUNTING PACKAGE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/045604
Kind Code:
A1
Abstract:
A semiconductor element-mounting package according to the present invention is provided with: a lead frame (2); a resin frame body (3) disposed on the lead frame (2) and having an accommodating portion (6) formed of an opening face of which the width becomes greater upwards from the lead frame (2); and a metal reflector which has an opening portion corresponding to the accommodating portion (6) of the resin frame body (3), and which is fit in the accommodating portion (6). The area of the opening portion of the metal reflector (4) becomes greater upwards from the lead frame (2). The metal reflector (4) has flange portions (5) around the opening portion on the side with the greater opening area. The flange portions (5) are placed on an upper surface of the resin frame body (3).
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Inventors:
NIWA IKUO
HASE YASUTAKA
AKAI SHUNSUKE
TAKAGI HAYATO
YOKOTA TOMOYUKI
SANADA HIROSHI
HASE YASUTAKA
AKAI SHUNSUKE
TAKAGI HAYATO
YOKOTA TOMOYUKI
SANADA HIROSHI
Application Number:
PCT/JP2019/034036
Publication Date:
March 05, 2020
Filing Date:
August 30, 2019
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L33/60; H01L23/29; H01L23/31; H01L23/48; H01L33/62
Foreign References:
| US20100149819A1 | 2010-06-17 | |||
| JP2008078500A | 2008-04-03 | |||
| JP2004335518A | 2004-11-25 | |||
| JP2003197974A | 2003-07-11 | |||
| JP2002319711A | 2002-10-31 | |||
| US20080023711A1 | 2008-01-31 | |||
| KR20110108755A | 2011-10-06 | |||
| JP2009009956A | 2009-01-15 | |||
| JP2005079167A | 2005-03-24 |
Attorney, Agent or Firm:
NII, Hiromori et al. (JP)
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