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Title:
SEMICONDUCTOR ELEMENT OVERTURNING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/155407
Kind Code:
A1
Abstract:
A semiconductor element overturning apparatus, comprising: a frame body (1); a loading and unloading module, the loading and unloading module being connected to the frame body (1) and used for loading and unloading external workpieces; a lifting module connected to the loading and unloading module and used for lifting the workpieces; and an overturning module connected to the frame body (1) and used for overturning the workpieces. The apparatus can perform distribution at different positions according to production requirements of subsequent procedures, so as to implement modular transfer, thereby achieving intelligent machining and conveying of workpieces without manual operation; the transfer process is smooth, the speed is high, and the efficiency is high, thus the stability of a machining period can be guaranteed, and the labor cost is reduced; and workpieces can be overturned when being transferred and transported, so that the problem that special workpieces need to be overturned is solved.

Inventors:
LIN HAITAO (CN)
ZHAO KAI (CN)
LIANG MENG (CN)
ZHENG JIANFENG (CN)
ZHANG HENGTAO (CN)
Application Number:
PCT/CN2022/115662
Publication Date:
August 24, 2023
Filing Date:
August 30, 2022
Export Citation:
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Assignee:
SHANGHAI TECHSENSE CO LTD (CN)
International Classes:
B65G47/248; H01L21/00
Foreign References:
CN114506649A2022-05-17
CN106241311A2016-12-21
JP2011219238A2011-11-04
CN210972953U2020-07-10
CN113816090A2021-12-21
US20150079719A12015-03-19
CN211162803U2020-08-04
CN209097533U2019-07-12
CN110012606A2019-07-12
Attorney, Agent or Firm:
DUAN&DUAN LAW FIRM (CN)
Download PDF:
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