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Patent Searching and Data


Title:
SEMICONDUCTOR ELEMENT PACKAGE AND LIGHT-EMITTING DEVICE COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2019/212285
Kind Code:
A1
Abstract:
An embodiment discloses a semiconductor element package and a light-emitting device comprising same. The semiconductor element package comprises: a body comprising a cavity; a first electrode and a second electrode arranged on the bottom surface of the cavity; a semiconductor element arranged on the first electrode; a protective element arranged on the first electrode and spaced apart from the semiconductor element; a first wire electrically connecting the semiconductor element and the second electrode; and a second wire electrically connecting the protective element and the second electrode. The second electrode is arranged to be spaced apart from the first electrode in a first direction. The second electrode overlaps the semiconductor element in the first direction. The protective element is arranged to deviate from the semiconductor element in a second direction that is perpendicular to the first direction. The first electrode comprises a groove arranged between the semiconductor element and the protective element.

Inventors:
OH, Jung Hun (17th Floor, LG Seoulstationbuilding 98, Huam-ro,Jung-gu, Seoul, 04637, KR)
Application Number:
KR2019/005324
Publication Date:
November 07, 2019
Filing Date:
May 03, 2019
Export Citation:
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Assignee:
LG INNOTEK CO., LTD. (98 Huam-ro, Jung-gu, Seoul, 04637, KR)
International Classes:
H01L33/62; H01L33/20; H01L33/38; H01L33/48
Foreign References:
KR20130007170A2013-01-18
JP2009260222A2009-11-05
JP2017063149A2017-03-30
JPH1154804A1999-02-26
US20120163026A12012-06-28
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (4~6th Floor, New Wing Gwangsung Bldg. 11, Yeoksam-ro 3-gil,Gangnam-gu, Seoul, 06242, KR)
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