Title:
SEMICONDUCTOR ELEMENT TRANSFER DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/155412
Kind Code:
A1
Abstract:
A semiconductor element transfer device, comprising: a transfer module used for transferring and conveying a workpiece; and a receiving module arranged on the side of the transfer module and used for receiving the workpiece transferred and conveyed by the transfer module. According to the semiconductor element transfer device, the parts are distributed at different positions according to the production requirements of subsequent procedures, modular transfer is achieved, intelligent workpiece machining and conveying are achieved, the manual operation is not needed, the transfer process is smooth, the speed is high, the efficiency is high, the stability of the machining period can be guaranteed, and the labor cost is saved.
Inventors:
LIN HAITAO (CN)
ZHAO KAI (CN)
LIANG MENG (CN)
ZHENG JIANFENG (CN)
ZHANG HENGTAO (CN)
ZHAO KAI (CN)
LIANG MENG (CN)
ZHENG JIANFENG (CN)
ZHANG HENGTAO (CN)
Application Number:
PCT/CN2022/115668
Publication Date:
August 24, 2023
Filing Date:
August 30, 2022
Export Citation:
Assignee:
SHANGHAI TECHSENSE CO LTD (CN)
International Classes:
B65G37/00
Foreign References:
| DE102019217033A1 | 2021-05-06 | |||
| JP2002270661A | 2002-09-20 | |||
| JPH09232403A | 1997-09-05 | |||
| JPH0873036A | 1996-03-19 | |||
| CN112794061A | 2021-05-14 | |||
| JPH11238775A | 1999-08-31 |
Attorney, Agent or Firm:
DUAN&DUAN LAW FIRM (CN)
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