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Patent Searching and Data


Title:
SEMICONDUCTOR ENCAPSULATING NON-LEAD GLASS AND SEMICONDUCTOR ENCAPSULATING COATING TUBE
Document Type and Number:
WIPO Patent Application WO/2012/060337
Kind Code:
A1
Abstract:
Provided are a semiconductor encapsulating non-lead glass and a semiconductor encapsulating coating tube that are able to encapsulate a semiconductor element at a low temperature, have superior acid resistance, and that resist precipitation of crystals during glass tube formation. The present invention is characterized by the glass composition containing, by mol%, 45-58% of SiO2, 0-6% of Al2O3, 14.5-30% of B2O3, 0-3% of MgO, 0-3% of CaO, 4.2-14.2% of ZnO, 5-12% of Li2O, 0-15% of Na2O, 0-7% of K2O, 15-30% of Li2O+Na2O+K2O, and 0.1-8% of TiO2, where ZnO/Li2O is in the range of 0.84-2.

Inventors:
HASHIMOTO KOICHI (JP)
KITAJI KUMIKO (JP)
Application Number:
PCT/JP2011/075092
Publication Date:
May 10, 2012
Filing Date:
October 31, 2011
Export Citation:
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Assignee:
NIPPON ELECTRIC GLASS CO (JP)
HASHIMOTO KOICHI (JP)
KITAJI KUMIKO (JP)
International Classes:
C03C3/093; C03C3/089; H01L23/08; H01L23/29; H01L23/31
Foreign References:
JP2003017632A2003-01-17
JP2010006627A2010-01-14
JP2002037641A2002-02-06
JPH08259258A1996-10-08
Other References:
G. ENNAS ET AL.: "Structure and chemical durability of zinc-containing glasses", JOURNAL OF NON-CRYSTALLINE SOLIDS, vol. 125, 1990, pages 181 - 185
Attorney, Agent or Firm:
NAITO TERUO (JP)
Teruo Naito (JP)
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Claims: