Title:
SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/039809
Kind Code:
A1
Abstract:
Provided is a semiconductor encapsulation resin composition containing (A) at least one thermosetting resin selected from the group consisting of an epoxy resin and a bismaleimide resin, (B) a curing agent, (C) an inorganic filler, and (D) a dispersant. The semiconductor encapsulation resin composition is a granular resin composition and has a minimum melt viscosity of 1-68000 mPa·s as measured, under the conditions of a mold temperature of 175°C and an injection speed Q of 178 mm3/sec, by a slit-type viscometer having a rectangular flow path (width W: 15 mm, thickness D: 1 mm, length: 175 mm).
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Inventors:
KOMORI IZUMI (JP)
Application Number:
PCT/JP2020/032084
Publication Date:
March 04, 2021
Filing Date:
August 25, 2020
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
H01L23/29; C08K3/00; C08K5/09; C08L35/00; C08L63/00; H01L23/31
Domestic Patent References:
| WO2018150779A1 | 2018-08-23 |
Foreign References:
| JP2016009814A | 2016-01-18 | |||
| JP2018024747A | 2018-02-15 | |||
| JP2016219600A | 2016-12-22 | |||
| JP2018039925A | 2018-03-15 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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