Title:
SEMICONDUCTOR HEAT TREATMENT DEVICE AND METHOD FOR CONTROLLING PRESSURE IN PROCESS CHAMBER THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/025076
Kind Code:
A1
Abstract:
A semiconductor heat treatment device and a method for controlling pressure in a process chamber thereof, relating to the technical field of semiconductor processing. The control method comprises: collecting an actual pressure value in a process chamber; according to a difference value between the actual pressure value and a preset target pressure value, determining a first valve opening value used for controlling the opening of an exhaust valve; determining a first valve opening variable quantity according to the first valve opening value and the current valve opening value; determining whether the first valve opening variable quantity is within a preset fluctuation range of the valve opening variable quantity corresponding to the current process stage; and under the condition that the first valve opening variable quantity is within the fluctuation range, adjusting the opening of the exhaust valve according to the first valve opening value.
Inventors:
JIA YAN (CN)
GENG DAN (CN)
CHEN ZHIMIN (CN)
GENG DAN (CN)
CHEN ZHIMIN (CN)
Application Number:
PCT/CN2022/113832
Publication Date:
March 02, 2023
Filing Date:
August 22, 2022
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
C30B29/06; C30B33/02; H01L21/67
Foreign References:
| CN113699590A | 2021-11-26 | |||
| CN107475693A | 2017-12-15 | |||
| JP2017156069A | 2017-09-07 | |||
| US20140007950A1 | 2014-01-09 | |||
| JPH1063345A | 1998-03-06 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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