Title:
SEMICONDUCTOR IC SOCKET
Document Type and Number:
WIPO Patent Application WO/2020/022051
Kind Code:
A1
Abstract:
Provided is a semiconductor IC socket that can prevent dust sticking to a light-receiving surface while not in contact with the light-receiving surface provided to the opposite side of the contact surface of an image sensor. This semiconductor IC socket is provided with: a pedestal (12) having a mounting surface (12a) on which an image sensor (60) is mounted; a base (10) that has an installation surface (10b) on which the pedestal (12) is installed, and a fixed surface (10a) positioned on the opposite side of the installation surface (10b) and fixed on an inspection substrate; and a lid member (18) that is not brought into contact with the image sensor (60) when the image sensor (60) is mounted on the pedestal (12) and that covers a back region (80) of the back (64) of the image sensor (60).
Inventors:
KOBAYASHI HIROKI (JP)
Application Number:
PCT/JP2019/027212
Publication Date:
January 30, 2020
Filing Date:
July 09, 2019
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
G01R31/26; H01R33/76; H01R13/52
Domestic Patent References:
| WO2019131164A1 | 2019-07-04 |
Foreign References:
| JP2007078539A | 2007-03-29 | |||
| CN201548740U | 2010-08-11 | |||
| US20090243644A1 | 2009-10-01 | |||
| JP2005174670A | 2005-06-30 | |||
| JP2000113954A | 2000-04-21 | |||
| JPH02119079A | 1990-05-07 | |||
| JPH0686293A | 1994-03-25 |
Other References:
See also references of EP 3832812A4
Attorney, Agent or Firm:
FUJITA, Takaharu (JP)
Download PDF: