SEMICONDUCTOR INSPECTION DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

WIPO Patent Application WO/2004/017082

A1

A semiconductor inspection device includes: sampling means having n-1 delay sections for delaying a sampling clock of a clock generator, n digital converters for converting a response waveform output from a semiconductor device into digital data according to the sampling clock output from the clock generator and sampling clocks output from the n-1 delay sections, a storage section for storing sampling data output from the n digital converters, and a waveform combining section for combining the sampling data stored in the storage section to generate a digital sampling waveform; and data processing means for generating from the digital sampling waveform obtained from the waveform combining section, a frequency spectrum in which a noise component generated by skew in the n-1 delay sections has been corrected. A semiconductor device manufacturing method using the semiconductor inspection device is also disclosed.

LI WEN (JP)
MAKUUCHI MASAMI (JP)
TAKAHASHI MASAYOSHI (JP)
KIKUCHI SHUJI (JP)

PCT/JP2003/009951

February 26, 2004

August 05, 2003

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HITACHI LTD (JP)
LI WEN (JP)
MAKUUCHI MASAMI (JP)
TAKAHASHI MASAYOSHI (JP)
KIKUCHI SHUJI (JP)

G01R23/16; G01R31/28; G01R31/316; G01R31/319; H01L21/66; H01L21/822; H01L27/04; H03M1/08; (IPC1-7): G01R31/316

WO2002059632A1

2002-08-01

JPH07254855A	1995-10-03
JP2001184602A	2001-07-06

Ogawa, Katsuo (Yusenkayabacho Building 9-8, Nihonbashi-kayabacho, 2-chom, Chuo-ku Tokyo, JP)

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