Title:
SEMICONDUCTOR INSPECTION EQUIPMENT AND SEMICONDUCTOR INSPECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2008/053518
Kind Code:
A1
Abstract:
Semiconductor inspection equipment which can check the electrical characteristics of
a device during a process, and can detect even a relatively small variation in
characteristics. The semiconductor inspection equipment is constituted such
that a semiconductor substrate is abutted against an electrode and irradiated with
an electron beam, a substrate current induced in the semiconductor substrate by
the electron beam is measured through the electrode, and the evaluation value of
a microstructure formed in the semiconductor substrate is obtained from the measurements.
The semiconductor inspection equipment is characterized in that the electrode
is constituted of a plurality of substrate current detection electrodes electrically
insulated from each other.
Inventors:
YAMADA KEIZO (JP)
Application Number:
PCT/JP2006/321666
Publication Date:
May 08, 2008
Filing Date:
October 30, 2006
Export Citation:
Assignee:
TOPCON CORP (JP)
YAMADA KEIZO (JP)
YAMADA KEIZO (JP)
International Classes:
G01R31/305
Domestic Patent References:
| WO2002013227A1 | 2002-02-14 |
Foreign References:
| JP2002083849A | 2002-03-22 | |||
| JPS5892232A | 1983-06-01 | |||
| JP2001345370A | 2001-12-14 | |||
| JP2000055991A | 2000-02-25 | |||
| JP2006128351A | 2006-05-18 |
Attorney, Agent or Firm:
SHIGA, Masatake et al. (Yaesu Chuo-k, Tokyo 53, JP)
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