Title:
SEMICONDUCTOR INTEGRATED CIRCUIT AND EVALUATION CIRCUIT FOR SEMICONDUCTOR INTEGRATED CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2008/023528
Kind Code:
A1
Abstract:
Disclosed is a semiconductor integrated circuit (10) comprising power supply
pads (131, 132, 133) for connection with the external power supply, circuit blocks
(111, 112, 113), power supply wires (121, 122, 123) respectively provided to
the circuit blocks (111, 112, 113) and connected to the power supply terminals
(131, 132, 133), power supply switches (151, 152, 153) interposed between the
power supply wire (121) and the power supply wire (122), and power supply switches
(161, 162, 163) interposed between the power supply wire (122) and the power supply
wire (123).
Inventors:
NAKAYAMA, Takeshi (())
中山 武司 (())
ISHII, Masahiro (())
中山 武司 (())
ISHII, Masahiro (())
Application Number:
JP2007/064592
Publication Date:
February 28, 2008
Filing Date:
July 25, 2007
Export Citation:
Assignee:
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1006, Oaza KadomaKadoma-shi, Osaka 01, 5718501, JP)
松下電器産業株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 5718501, JP)
NAKAYAMA, Takeshi (())
中山 武司 (())
松下電器産業株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 5718501, JP)
NAKAYAMA, Takeshi (())
中山 武司 (())
International Classes:
G01R31/28; H01L21/822; H01L27/04; G01R31/28; H01L21/70; H01L27/04
Attorney, Agent or Firm:
NAKAJIMA, Shiro et al. (6F Yodogawa 5-Bankan, 2-1 Toyosaki 3-chome, Kita-k, Osaka-shi Osaka 72, 5310072, JP)
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