Title:
SEMICONDUCTOR LASER BEAM COMBINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/205500
Kind Code:
A1
Abstract:
A semiconductor laser beam combining device includes at least two modular laser input equipments (10), a second diffraction grating (5), and an output coupler (6). The modular laser input equipment includes a semiconductor laser (9), a beam shaping component (2), a transformation lens (3), and a first diffraction grating (4) arranged along an optical path in sequence. The semiconductor laser generates a beam. The semiconductor laser is located at a front focal point of the transformation lens. The first diffraction grating is located in front of a back focal point of the transformation lens. Each beam is gathered by the transformation lens and diffracted by the first diffraction grating to the second diffraction grating. Each beam is combined at an identical position and an identical diffraction angle on the second diffraction grating to generate a combined beam. The combined beam from the second diffraction grating enters the output coupler vertically and is outputted by the output coupler.
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Inventors:
LI DASHAN (CN)
ZHAO YAPING (CN)
ZHANG QIAN (CN)
ZHOU QUAN (CN)
ZHAO YAPING (CN)
ZHANG QIAN (CN)
ZHOU QUAN (CN)
Application Number:
PCT/CN2018/109579
Publication Date:
October 31, 2019
Filing Date:
October 10, 2018
Export Citation:
Assignee:
II VI SUWTECH INC (CN)
International Classes:
H01S5/40; G02B27/10
Foreign References:
| CN208062488U | 2018-11-06 | |||
| CN108321677A | 2018-07-24 | |||
| CN104901149A | 2015-09-09 | |||
| CN106684702A | 2017-05-17 | |||
| CN106532435A | 2017-03-22 | |||
| CN106711753A | 2017-05-24 | |||
| CN104332821A | 2015-02-04 | |||
| CN103081261A | 2013-05-01 |
Attorney, Agent or Firm:
SHANGHAI LUNGTIN LAW FIRM (CN)
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