Title:
SEMICONDUCTOR LASER DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2016/158068
Kind Code:
A1
Abstract:
The purpose of the present invention is to achieve a semiconductor laser device wherein warpage generated in a semiconductor laser element and a sub-mount is further suppressed compared with conventional cases. This semiconductor laser device is provided with: a sub-mount; material layers that are respectively formed on two surfaces of the sub-mount, said two surfaces facing each other; a solder layer formed on an upper layer of one of the material layers; and a semiconductor laser element formed on the upper layer of the solder layer. A facing region where the sub-mount and the semiconductor laser element face each other has a first region, which includes both the material layer and the solder layer in the first direction orthogonal to the sub-mount surfaces, and a second region, which includes the material layer or the solder layer, or does not include both the material layer and the solder layer in the first direction.
Inventors:
KONTANI TORU (JP)
SATO HIROTO (JP)
SATO HIROTO (JP)
Application Number:
PCT/JP2016/054858
Publication Date:
October 06, 2016
Filing Date:
February 19, 2016
Export Citation:
Assignee:
USHIO ELECTRIC INC (JP)
International Classes:
H01S5/0239; H01S5/024
Foreign References:
| JP2006339212A | 2006-12-14 | |||
| JP2010278364A | 2010-12-09 | |||
| JP2006344764A | 2006-12-21 | |||
| JP2014197608A | 2014-10-16 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
Download PDF: