Title:
SEMICONDUCTOR LASER DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/009172
Kind Code:
A1
Abstract:
This semiconductor laser devices provided with a first heat dissipating member (10) inside of which a first flow path (11) and a second flow path (12) circulating a refrigerant are provided independently of each other, a second heat dissipating member (20) which is provided contacting the upper surface of the first heat dissipating member and which includes an insulating member having a third flow path (23) therein that communicates with the first flow path (11), a lower electrode block (60) which is provided on part of the upper surface of the second heat dissipating member, a submount (30) which is configured from a conductive material provided on the remainder of the upper surface of the second heat dissipating member (20), a semiconductor laser element (40) which is arranged on the upper surface of the submount (30), and an upper electrode block (61) which is provided such that the submount (30) and the semiconductor laser element (40) are held between said upper electrode block and the second heat dissipating member (20), wherein the second flow path (12) is provided below the region where the lower electrode block (60) is arranged.
Inventors:
OOMORI KOUJI
TSUMURA KOUKI
KASAI TERUAKI
TSUMURA KOUKI
KASAI TERUAKI
Application Number:
PCT/JP2018/024535
Publication Date:
January 10, 2019
Filing Date:
June 28, 2018
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
H01L23/36; H01S5/024; H01S5/023; H01S5/0233
Domestic Patent References:
| WO1999039412A1 | 1999-08-05 | |||
| WO2011111328A1 | 2011-09-15 |
Foreign References:
| JP2004146720A | 2004-05-20 | |||
| JP2014033016A | 2014-02-20 | |||
| US9001856B1 | 2015-04-07 | |||
| JP2008172141A | 2008-07-24 | |||
| JP3951919B2 | 2007-08-01 |
Other References:
See also references of EP 3651292A4
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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