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Patent Searching and Data


Title:
SEMICONDUCTOR LASER DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/188106
Kind Code:
A1
Abstract:
Provided is a small-scale semiconductor laser device in which high heat dissipation properties are ensured even while a high-output semiconductor laser chip is mounted thereon. The invention comprises: a hollow-shaped metallic casing covered by outer faces including a first face having a first opening section and a second face having a second opening section; a semiconductor laser chip housed inside the casing; a lid body formed from an insulating material placed on the upper surface of the first face so as to close the first opening section; a window part containing a translucent member, placed on the upper surface of the second face in such a manner that at least one portion of the translucent member faces the second opening section; electrode parts formed from electroconductive materials, each formed so as to establish, by traversing through the lid body, a connection between a portion of the surface of the lid body on the casing side thereof and a portion of the surface of the lid body on the side facing away from the casing; and electric supply terminals for electrically connecting the semiconductor laser chip to the electrode parts exposed on the surface of the lid body on the casing side thereof.

Inventors:
KONTANI,Toru (1-6-5 Marunouchi, Chiyoda-k, Tokyo 50, 〒1008150, JP)
SHINMORI,Tatsunori (1-6-5 Marunouchi, Chiyoda-k, Tokyo 50, 〒1008150, JP)
WATANABE,Masashi (1-6-5 Marunouchi, Chiyoda-k, Tokyo 50, 〒1008150, JP)
Application Number:
JP2019/009237
Publication Date:
October 03, 2019
Filing Date:
March 08, 2019
Export Citation:
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Assignee:
USHIO DENKI KABUSHIKI KAISHA (1-6-5, Marunouchi Chiyoda-k, Tokyo 50, 〒1008150, JP)
International Classes:
H01S5/022; H01S5/024
Foreign References:
JP2018029199A2018-02-22
JP2017098549A2017-06-01
US20170068059A12017-03-09
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (First Shin-Osaka MT Bldg. 2nd Floor, 5-13-9 Nishinakajima Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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