Title:
SEMICONDUCTOR LASER ELEMENT, CHIP ON SUBMOUNT, AND SEMICONDUCTOR LASER MODULE
Document Type and Number:
WIPO Patent Application WO/2017/122782
Kind Code:
A1
Abstract:
Disclosed is an edge emitting semiconductor laser element wherein waveguide mode of a waveguide is multimode. A semiconductor laser element of the present invention is characterized in that: the horizontal-direction width of a waveguide edge surface on the front side in the output direction, and the horizontal-direction width of a waveguide edge surface on the rear side in the output direction are substantially same first width; and the width of the waveguide is smaller than the first width at least at a part between the edge surface on the front side in the output direction, and the edge surface on the rear side in the output direction.
Inventors:
KAJI EISAKU (JP)
OHKI YUTAKA (JP)
OHKI YUTAKA (JP)
Application Number:
PCT/JP2017/001023
Publication Date:
July 20, 2017
Filing Date:
January 13, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01S5/22; H01S5/023; H01S5/0233
Domestic Patent References:
| WO1995013639A1 | 1995-05-18 |
Foreign References:
| JP2003101139A | 2003-04-04 | |||
| JP2009164389A | 2009-07-23 | |||
| JP2009021506A | 2009-01-29 | |||
| JPS6151770U | 1986-04-07 | |||
| JPH01273378A | 1989-11-01 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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