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Patent Searching and Data


Title:
SEMICONDUCTOR LASER ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR LASER ELEMENT
Document Type and Number:
WIPO Patent Application WO/2018/134950
Kind Code:
A1
Abstract:
The present invention is characterized by being provided with: a semiconductor substrate; a resonator unit that is formed on the semiconductor substrate and that has an active layer, the frond end surface of a reverse mesa inclined surface, and the rear end surface ; an anti-reflection coating film that is formed on the front end surface; a reflection film that is formed on the rear end surface; a diffraction grating that is formed on or under the active layer; an upper electrode that is formed on the resonator unit; and a lower electrode that is formed below the semiconductor substrate, wherein the length of the resonator unit in a resonator direction is shorter than that of the semiconductor substrate in the resonator direction, and a laser beam is emitted from the front end surface.

Inventors:
FUCHIDA AYUMI (JP)
OKUNUKI YUICHIRO (JP)
SAKAINO GO (JP)
UETSUJI TETSUYA (JP)
NAKAMURA NAOKI (JP)
Application Number:
PCT/JP2017/001769
Publication Date:
July 26, 2018
Filing Date:
January 19, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01S5/12
Foreign References:
JPS59152682A1984-08-31
JP2003174229A2003-06-20
JPS60152086A1985-08-10
JPS6180885A1986-04-24
JPS6079786A1985-05-07
JP2016189437A2016-11-04
JP2013239682A2013-11-28
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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