Title:
SEMICONDUCTOR LASER MODULE AND ADDITIVE MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/051430
Kind Code:
A1
Abstract:
The present invention minimizes variations in the coupling efficiency of the light output from a laser element to an optical fiber. A semiconductor laser module comprises a plurality of semiconductor laser elements, an optical fiber, a light collection means for collecting the laser light emitted from the semiconductor laser elements into the optical fiber, and a housing having the laser elements, the light collection means, and the optical fiber mounted therein, the semiconductor laser module including at least one thin plate disposed between the laser elements and the top plate of the housing and mounted on the top plate to form a gap with the top plate.
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Inventors:
ISHIGE YUTA (JP)
KATAYAMA ETSUJI (JP)
MORI HAJIME (JP)
KATAYAMA ETSUJI (JP)
MORI HAJIME (JP)
Application Number:
PCT/JP2016/077102
Publication Date:
March 22, 2018
Filing Date:
September 14, 2016
Export Citation:
Assignee:
TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING (JP)
International Classes:
G02B6/42; H01S5/024; H01S5/0239
Foreign References:
| JP2004006440A | 2004-01-08 | |||
| JP2016071005A | 2016-05-09 | |||
| JP2012070007A | 2012-04-05 | |||
| JP2004096088A | 2004-03-25 |
Other References:
See also references of EP 3324229A4
Attorney, Agent or Firm:
KATO Takashi et al. (JP)
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