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Title:
SEMICONDUCTOR LASER AND MODULE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/135629
Kind Code:
A1
Abstract:
A semiconductor laser (10) according to the present invention comprises a first clad layer (102), an active layer (104), and a second clad layer (106) in order on a substrate (101), a ridge part disposed in the waveguide direction in the second clad layer and a heater (113) disposed near the ridge part are provided, and the oscillation wavelength is 1.6-2.4 µm. Between the first clad layer and the active layer, and the active layer and the second clad layer, respectively, a first guide layer (103), a second guide layer (105), a diffraction grating (112) at the boundary between the first clad layer and the first guide layer or the boundary between the second clad layer and the second guide layer, and an insulating film (111) on the surface of the second guide layer other than the ridge part are provided, and the heater is disposed on the insulating film. As a result, the present invention can provide a semiconductor laser that performs wavelength sweeps at fast speed and over a wide wavelength range.

Inventors:
MITSUHARA MANABU (JP)
KOBAYASHI WATARU (JP)
Application Number:
PCT/JP2022/000487
Publication Date:
July 20, 2023
Filing Date:
January 11, 2022
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE (JP)
International Classes:
H01S5/024; H01S5/22; H01S5/343
Foreign References:
JP2014192248A2014-10-06
JP2000294869A2000-10-20
JP2006278397A2006-10-12
JP2018019086A2018-02-01
JP2016197616A2016-11-24
JP2000277869A2000-10-06
JP2001235418A2001-08-31
Attorney, Agent or Firm:
YAMAKAWA, Shigeki et al. (JP)
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