Title:
SEMICONDUCTOR LASER MODULE AND PRODUCTION METHOD FOR SEMICONDUCTOR LASER MODULE
Document Type and Number:
WIPO Patent Application WO/2018/117251
Kind Code:
A1
Abstract:
A semiconductor laser module comprising: a semiconductor laser element; a waveguide-type optical functional element having a waveguide that has incident thereto laser light emitted from the semiconductor laser element and guides said light; and a protruding object provided above an extension line relating to the incident end of the waveguide in the waveguide-type optical functional element in the optical path of the laser light emitted from the semiconductor laser element. The semiconductor laser module also comprises a sub-mount having the waveguide-type optical functional element fixed thereto. The protruding object can be fixed upon the sub-mount.
Inventors:
ARIGA MAIKO (JP)
INABA YUSUKE (JP)
YAMAOKA KAZUKI (JP)
SUGAYA TOSHIO (JP)
INABA YUSUKE (JP)
YAMAOKA KAZUKI (JP)
SUGAYA TOSHIO (JP)
Application Number:
PCT/JP2017/046089
Publication Date:
June 28, 2018
Filing Date:
December 22, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
G02B6/42; H01S5/0239; H01S5/40
Domestic Patent References:
| WO2013180291A1 | 2013-12-05 | |||
| WO2010138478A1 | 2010-12-02 | |||
| WO2007108508A1 | 2007-09-27 |
Foreign References:
| US20160013616A1 | 2016-01-14 | |||
| JP2012164737A | 2012-08-30 | |||
| EP1492208A2 | 2004-12-29 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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