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Title:
SEMICONDUCTOR LASER MODULE AND SEMICONDUCTOR LASER MODULE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/135379
Kind Code:
A1
Abstract:
Provided is a semiconductor laser module that can achieve size reduction. This semiconductor laser module 1 comprises an optical fiber 44 and semiconductor laser elements 30A to 30E. Each of the semiconductor laser elements 30A to 30E comprises a semiconductor chip 31, electrode pads 32, 33, and a mount 34. The semiconductor laser module 1 further comprises: an installation section 20 having a steplike formation constituted by installation surfaces 21A to 21E, each whereof having installed thereon the mount 34; and an optical system for connecting laser light to an inlet end face 44A of the optical fiber 44. The semiconductor laser elements 30A to 30E include an upper-side semiconductor laser element 30C and a lower-side semiconductor laser element 30B, which are adjacent in the Z-direction. A portion of the upper-side semiconductor laser element 30C extends out from the installation surface 21C toward the lower-side semiconductor laser element 30B.

Inventors:
KATAGIRI Ken (Sakura Works 1440, Mutsuzaki, Sakura-sh, Chiba 50, 〒2858550, JP)
KASAI Yohei (Sakura Works 1440, Mutsuzaki, Sakura-sh, Chiba 50, 〒2858550, JP)
Application Number:
JP2018/047911
Publication Date:
July 11, 2019
Filing Date:
December 26, 2018
Export Citation:
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Assignee:
FUJIKURA LTD. (5-1 Kiba 1-chome, Koto-ku Tokyo, 12, 〒1358512, JP)
International Classes:
H01S5/40; G02B6/42; H01S5/022
Attorney, Agent or Firm:
MORI Tomohiro (APERIO IP ATTORNEYS, MIII Bldg. 6F 1-17-1 Uchikanda, Chiyoda-k, Tokyo 47, 〒1010047, JP)
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