Title:
SEMICONDUCTOR LIGHT-EMITTING ELEMENT CHIP INTEGRATION DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/256447
Kind Code:
A1
Abstract:
In the present invention, droplet-like ink containing a plurality of vertical type semiconductor light-emitting element chips 40 each having a p-side electrode and an n-side electrode vertically and configured such that one of the p-side electrode and the n-side electrode is attracted to a magnetic field more strongly than the other, is supplied to chip joint parts 421 of a lower electrode 420 on a mounting substrate 400. Each of the semiconductor light-emitting element chips 40 in the ink, by application of a magnetic field, is joined to a corresponding one of the chip joint parts by directing one of the p-side electrode and the n-side electrode to the chip joint part. An upper electrode 430 having an upper electrode main line part 431 and a plurality of upper electrode branch line parts 432, which are connected to each other with a thin-film fuse 433, is formed as an upper layer of the semiconductor light-emitting element chip 40 such that the upper electrode branch line parts 432 and the other of the p-side electrode and the n-side electrode of the semiconductor light-emitting element chip 40 are electrically connected to each other.
Inventors:
TAKEYA MOTONOBU (JP)
Application Number:
PCT/JP2021/022602
Publication Date:
December 23, 2021
Filing Date:
June 15, 2021
Export Citation:
Assignee:
ULDTEC CO LTD (JP)
International Classes:
H01L33/62; G09F9/33; H01L23/12; H01L25/00; H01L33/00; H01L33/38; H01L33/40
Domestic Patent References:
| WO2015015915A1 | 2015-02-05 | |||
| WO2012003253A1 | 2012-01-05 | |||
| WO2006025497A1 | 2006-03-09 | |||
| WO2021084783A1 | 2021-05-06 |
Foreign References:
| JP6694222B1 | 2020-05-13 | |||
| JP2020025064A | 2020-02-13 | |||
| JP2018170339A | 2018-11-01 | |||
| US20170062393A1 | 2017-03-02 | |||
| JP2016025205A | 2016-02-08 | |||
| JP2013004792A | 2013-01-07 | |||
| JP2012195406A | 2012-10-11 | |||
| US20100170086A1 | 2010-07-08 | |||
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| JP2003216052A | 2003-07-30 | |||
| JP2001257218A | 2001-09-21 | |||
| JPH08137413A | 1996-05-31 |
Attorney, Agent or Firm:
MORI Koh-ichi (JP)
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