Title:
SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND LAMINATE CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2013/022123
Kind Code:
A1
Abstract:
This semiconductor light-emitting element is provided with: a group 13 element nitride film (3) grown on a seed crystal substrate in a nitrogen-containing atmosphere from a melt containing a flux and a group 13 element by a flux method; an n-type semiconductor layer (21) disposed on the group 13 element nitride film (3); a light-emitting region (23) disposed on the n-type semiconductor layer; and a p-type semiconductor layer (25) which is disposed on the light-emitting region. The semiconductor light-emitting element contains: an inclusion-distributed layer (3a), in which an inclusion derived from the components of the melt is distributed, disposed in a region that is 50 μm or less from an interface (11a) on the seed crystal semiconductor side of the group 13 element nitride film (3); and an inclusion-deficient layer (2b), which is deficient in inclusion, disposed on the inclusion-distributed layer.
Inventors:
IWAI MAKOTO (JP)
HIRAO TAKAYUKI (JP)
YOSHINO TAKASHI (JP)
HIRAO TAKAYUKI (JP)
YOSHINO TAKASHI (JP)
Application Number:
PCT/JP2012/070782
Publication Date:
February 14, 2013
Filing Date:
August 09, 2012
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
IWAI MAKOTO (JP)
HIRAO TAKAYUKI (JP)
YOSHINO TAKASHI (JP)
IWAI MAKOTO (JP)
HIRAO TAKAYUKI (JP)
YOSHINO TAKASHI (JP)
International Classes:
H01L33/32; C30B9/00; C30B29/38
Domestic Patent References:
WO2005111278A1 | 2005-11-24 | |||
WO2010084675A1 | 2010-07-29 | |||
WO2009047894A1 | 2009-04-16 |
Foreign References:
JP2005247615A | 2005-09-15 | |||
JP2004224600A | 2004-08-12 | |||
JP2006008416A | 2006-01-12 | |||
JP2006036622A | 2006-02-09 | |||
JP2010052967A | 2010-03-11 |
Attorney, Agent or Firm:
HOSODA, Masutoshi et al. (JP)
Masunori Hosoda (JP)
Masunori Hosoda (JP)
Download PDF:
Claims:
Previous Patent: GROUP 13 ELEMENT NITRIDE FILM AND LAMINATE THEREOF
Next Patent: WATERPROOF CONNECTOR AND MANUFACTURING METHOD THEREOF
Next Patent: WATERPROOF CONNECTOR AND MANUFACTURING METHOD THEREOF