Title:
SEMICONDUCTOR MANUFACTURING DEVICE MEMBER
Document Type and Number:
WIPO Patent Application WO/2018/230446
Kind Code:
A1
Abstract:
A semiconductor manufacturing device member 10 is provided with: an alumina sintered body-made plate 12 having a front surface which is a wafer placement surface 12a and having electrodes 14, 16 incorporated therein; at least one through hole 18 which penetrates the plate 12 in the thickness direction; and an alumina sintered body-made insulation tube 20 (tubular member) bonded to the rear surface 12b of the plate 12 via a first bonding layer 24 which is made of an alumina sintered body and which has a ring shape.
Inventors:
TAKEBAYASHI HIROSHI (JP)
Application Number:
PCT/JP2018/021928
Publication Date:
December 20, 2018
Filing Date:
June 07, 2018
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/02; H01L21/683; H05B3/74
Foreign References:
| JP2004128232A | 2004-04-22 | |||
| JP2011238682A | 2011-11-24 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
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