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Title:
SEMICONDUCTOR MANUFACTURING DEVICE SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/210560
Kind Code:
A1
Abstract:
This semiconductor manufacturing device system (100) is provided with a substrate holding hand (30), a capturing unit (60) that captures at least a component of a semiconductor manufacturing device (103), and a control unit that detects an abnormality in the component of the semiconductor manufacturing device (103) on the basis of a captured image captured by the capturing unit (60).

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Inventors:
HASHIZAKI SATOSHI
KITANO SHINYA
KANAMARU RYOUSUKE
YAMASHITA KATSUHIRO
NAGASAWA TOMOYA
Application Number:
PCT/JP2023/016056
Publication Date:
November 02, 2023
Filing Date:
April 24, 2023
Export Citation:
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Assignee:
KAWASAKI HEAVY IND LTD (JP)
International Classes:
H01L21/677; B25J13/08
Foreign References:
KR20160124965A2016-10-31
JP2013105948A2013-05-30
JP2020191370A2020-11-26
JP2004148447A2004-05-27
JP2001015575A2001-01-19
Attorney, Agent or Firm:
MIYAZONO Hirokazu (JP)
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