Title:
SEMICONDUCTOR MANUFACTURING METHOD AND DEVICE THEREOF
Document Type and Number:
WIPO Patent Application WO/2003/077291
Kind Code:
A1
Abstract:
In a semiconductor manufacturing method for working a semiconductor substrate in each manufacturing step of the semiconductor manufacturing line, a semiconductor substrate carried into a manufacturing device arranged at each manufacturing step imaged before and after working to obtain image data, so as to detect a defect caused by a working condition of the manufacturing device from the image data before working or preferable master image data and the image data after the working. According to the detection result, the working condition of the manufacturing device is modified/controlled for working the semiconductor substrate.
Inventors:
TANAKA TOSHIHIKO (JP)
Application Number:
PCT/JP2003/002939
Publication Date:
September 18, 2003
Filing Date:
March 12, 2003
Export Citation:
Assignee:
OLYMPUS OPTICAL CO (JP)
TANAKA TOSHIHIKO (JP)
TANAKA TOSHIHIKO (JP)
International Classes:
G03F7/20; H01L21/00; (IPC1-7): H01L21/027; G03F7/20
Foreign References:
| JP2003031488A | 2003-01-31 | |||
| JP2001118781A | 2001-04-27 | |||
| US6281962B1 | 2001-08-28 | |||
| EP0973069A2 | 2000-01-19 | |||
| JPH10261692A | 1998-09-29 | |||
| JPH03230516A | 1991-10-14 |
Attorney, Agent or Firm:
Suzuye, Takehiko c/o SUZUYE & SUZUYE (7-2 Kasumigaseki 3-chom, Chiyoda-ku Tokyo, JP)
Download PDF:
Previous Patent: ETCHING METHODS FOR A MAGNETIC MEMORY CELL STACK
Next Patent: METHOD OF MANUFACTURING NANOWIRES AND AN ELECTRONIC DEVICE
Next Patent: METHOD OF MANUFACTURING NANOWIRES AND AN ELECTRONIC DEVICE