SEMICONDUCTOR MODULE AND CONTROL METHOD OF SAME

WIPO Patent Application WO/2010/084550

A1

A high density semiconductor module able to suitably detect temperature rise and perform suitable control.  A multilayer structure comprising a lower layer chip (11) and an upper layer chip (12) is mounted on top of a lead frame (15) formed from copper or other material with high thermal conductivity.  Similarly, another multilayer structure comprising a lower layer chip (13) and an upper layer chip (14) is mounted on top of the lead frame (15).  Further, a control circuit chip (16) is mounted between these two multilayer structures.  Temperature sensors (30) are mounted to the inward sides (the sides where the control circuit chip (16) is located) on the upper surfaces of the lower chips (11, 13).  The temperature sensors (30) are set on top of the interconnect (41) which serves as the current path.

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INOUE, Takashi (6-3, Kitano 3-chome, Niiza-sh, Saitama 66, 〒3528666, JP)
井上隆 (〒66 埼玉県新座市北野３丁目６番３号　サンケン電気株式会社内 Saitama, 〒3528666, JP)

JP2009/006949

July 29, 2010

December 17, 2009

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Sanken Electric Co.,Ltd. (6-3 Kitano 3-chome, Niiza-shi Saitama, 66, 〒3528666, JP)
サンケン電気株式会社 (〒66 埼玉県新座市北野３丁目６番３号 Saitama, 〒3528666, JP)
INOUE, Takashi (6-3, Kitano 3-chome, Niiza-sh, Saitama 66, 〒3528666, JP)

H01L25/065; H01L23/58; H01L25/07; H01L25/18

HORI, Shiroyuki et al. (1F Shoyu-kaikan Bldg, 3-3-1 Kasumigaseki, Chiyoda-k, Tokyo 13, 〒1000013, JP)

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