Title:
SEMICONDUCTOR MODULE, ELECTRIC CONNECTOR, AND INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/009652
Kind Code:
A1
Abstract:
This semiconductor module (10) is provided with a control IC (11) that is mounted upon a mounting substrate (16) and with a plurality of semiconductor chips (20) that are mounted upon the mounting substrate (16). Each of the plurality of semiconductor chips (20) is provided with a first and a second transistor (21, 22) that are connected in series between an inspection target device and a tester. The first transistor (21) and the second transistor (22) have a common drain electrode on the substrate side of the semiconductor chip (20). A source electrode of the first transistor (21) is connected to a power-source-channel side of the tester. A source electrode of the second transistor (22) is connected to an electrode side of the inspection target device. The connection between the tester and the inspection target device is controlled by a control signal that is supplied from the control IC (11) to gate electrodes of the first and the second transistor (21, 22) via wiring.
Inventors:
NAKATA YOSHIRO (JP)
Application Number:
PCT/JP2015/003588
Publication Date:
January 21, 2016
Filing Date:
July 16, 2015
Export Citation:
Assignee:
NIHON MICRONICS KK (JP)
International Classes:
G01R31/28; G01R31/26; H01L21/66; H01L25/04; H01L25/18
Domestic Patent References:
| WO2013057857A1 | 2013-04-25 |
Foreign References:
| JP2014025761A | 2014-02-06 | |||
| JP2010156569A | 2010-07-15 |
Attorney, Agent or Firm:
IEIRI, Takeshi (JP)
House ON 健 (JP)
House ON 健 (JP)
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