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Patent Searching and Data


Title:
SEMICONDUCTOR MODULE AND INVERTER DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/138414
Kind Code:
A1
Abstract:
This semiconductor module is provided with a first conductive plate, a first switching element mounted on the first conductive plate, a second conductive plate provided on the first switching element, a second switching element laminated on the second conductive plate, a third conductive plate provided on the second switching element, and first and second control terminals. Each of the switching elements is configured using silicon carbide. On a second lower conductive plate surface of the second conductive plate, a protruding part is provided that protrudes from said second lower conductive plate surface toward a first element upper surface and that is bonded to a first upper electrode.

Inventors:
KATO NAOKI (JP)
MORI SHOGO (JP)
Application Number:
PCT/JP2017/003572
Publication Date:
August 17, 2017
Filing Date:
February 01, 2017
Export Citation:
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Assignee:
TOYOTA JIDOSHOKKI KK (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/065; H01L25/18; H02M7/48
Domestic Patent References:
WO2014132397A12014-09-04
Foreign References:
JP2002026251A2002-01-25
JP2009043820A2009-02-26
JP2006134990A2006-05-25
JP2014183078A2014-09-29
JP2004193476A2004-07-08
JP2004140068A2004-05-13
Other References:
See also references of EP 3416189A4
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
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