Title:
SEMICONDUCTOR MODULE AND INVERTER DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/138414
Kind Code:
A1
Abstract:
This semiconductor module is provided with a first conductive plate, a first switching element mounted on the first conductive plate, a second conductive plate provided on the first switching element, a second switching element laminated on the second conductive plate, a third conductive plate provided on the second switching element, and first and second control terminals. Each of the switching elements is configured using silicon carbide. On a second lower conductive plate surface of the second conductive plate, a protruding part is provided that protrudes from said second lower conductive plate surface toward a first element upper surface and that is bonded to a first upper electrode.
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Inventors:
KATO NAOKI (JP)
MORI SHOGO (JP)
MORI SHOGO (JP)
Application Number:
PCT/JP2017/003572
Publication Date:
August 17, 2017
Filing Date:
February 01, 2017
Export Citation:
Assignee:
TOYOTA JIDOSHOKKI KK (JP)
International Classes:
H01L25/07; H01L23/48; H01L25/065; H01L25/18; H02M7/48
Domestic Patent References:
WO2014132397A1 | 2014-09-04 |
Foreign References:
JP2002026251A | 2002-01-25 | |||
JP2009043820A | 2009-02-26 | |||
JP2006134990A | 2006-05-25 | |||
JP2014183078A | 2014-09-29 | |||
JP2004193476A | 2004-07-08 | |||
JP2004140068A | 2004-05-13 |
Other References:
See also references of EP 3416189A4
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
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