Title:
SEMICONDUCTOR MODULE AND INVERTER HAVING SEMICONDUCTOR MODULE MOUNTED THEREON
Document Type and Number:
WIPO Patent Application WO/2013/018343
Kind Code:
A1
Abstract:
A semiconductor module (200) has a substrate (40) and a substrate (44) disposed to face the substrate (40). A high heat generating main surface (S10) of the semiconductor element (10) is provided to face the substrate (44) side, and is thermally connected to the substrate (44) via a wiring layer (54e). A high heat generating main surface (S11) of the semiconductor element (11) is provided to face the substrate (40) side, and is thermally connected to the substrate (40) via a wiring layer (50c). Furthermore, an emitter electrode of the semiconductor element (10) and a collector electrode of the semiconductor element (11) are electrically connected to each other via the wiring layer (54e) and a heat spreader (64).
Inventors:
YAMAMOTO TETSUYA (JP)
USUI RYOSUKE (JP)
USUI RYOSUKE (JP)
Application Number:
PCT/JP2012/004809
Publication Date:
February 07, 2013
Filing Date:
July 27, 2012
Export Citation:
Assignee:
SANYO ELECTRIC CO (JP)
YAMAMOTO TETSUYA (JP)
USUI RYOSUKE (JP)
YAMAMOTO TETSUYA (JP)
USUI RYOSUKE (JP)
International Classes:
H01L25/18; H01L25/07; H02M7/48
Foreign References:
| JP2008124430A | 2008-05-29 | |||
| JP2008227131A | 2008-09-25 |
Attorney, Agent or Firm:
MORISHITA, SAKAKI (JP)
Sakaki Morishita (JP)
Sakaki Morishita (JP)
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Claims: