Title:
SEMICONDUCTOR MODULE MANUFACTURING METHOD, SEMICONDUCTOR MODULE, AND MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/104826
Kind Code:
A1
Abstract:
In the disclosed method for manufacturing a semiconductor module (100), a metal layer (20) and a cooler (30), which have different coefficients of thermal expansion from each other, are joined into a single unit via an insulating resin sheet (40). A work (1), comprising a semiconductor element (10) placed on the metal layer (20) with solder (15) interposed therebetween, is fed into a reflow furnace (200). The work, in that state, is heated in the reflow furnace (200), thereby mounting the semiconductor element (10) to the metal layer (20). The heating is carried out such that the temperature of the cooler (30) and the temperature of the metal layer (20) differ by an amount that make the cooler (30) and the metal layer (20) undergo the same amount of thermal expansion as each other.
Inventors:
MIZUNO Hiroki (1 Toyota-cho, Toyota-sh, Aichi 71, 〒4718571, JP)
Application Number:
JP2010/052810
Publication Date:
September 01, 2011
Filing Date:
February 24, 2010
Export Citation:
Assignee:
TOYOTA JIDOSHA KABUSHIKI KAISHA (1 Toyota-cho, Toyota-shi Aichi, 71, 〒4718571, JP)
トヨタ自動車株式会社 (〒71 愛知県豊田市トヨタ町１番地 Aichi, 〒4718571, JP)
トヨタ自動車株式会社 (〒71 愛知県豊田市トヨタ町１番地 Aichi, 〒4718571, JP)
International Classes:
H01L23/40; B23K1/19; B23K31/02
Attorney, Agent or Firm:
COSMOS PATENT OFFICE (Annex 2nd Floor, Nagoya Center Building 2-22, Nishiki 2-chome, Naka-ku, Nagoya-sh, Aichi 03, 〒4600003, JP)
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Claims: