LIGHT−EMITTING OR LIGHT−RECEIVING SEMICONDUCTOR MODULE AND METHOD OF ITS MANUFACTURE

Title:

LIGHT−EMITTING OR LIGHT−RECEIVING SEMICONDUCTOR MODULE AND METHOD OF ITS MANUFACTURE

Document Type and Number:

WIPO Patent Application WO/2003/017382

Kind Code:

A1

Abstract:

A semiconductor module (20) comprises twenty five semiconductor devices (10), for example, having photoelectric conversion function and arranged in a 5×5 matrix through an electrical connection mechanism comprising six connection leads (21−26), wherein the semiconductor devices (10) in each column are connected in series and the semiconductor devices (10) in each row are connected in parallel. Furthermore, a positive electrode terminal and a negative electrode terminal are buried in a light transmission member (28) of transparent synthetic resin and project to the outside. The semiconductor device (10) has a diffusion layer, a pn junction and one planar face on the surface of a spherical p−type semiconductor crystal, for example, wherein a positive electrode (6a) connected with the p−type semiconductor crystal and a negative electrode (6b) facing the positive electrode (6a) through the center are formed on the planar face.

Inventors:

NAKATA JOSUKE (JP)

Application Number:

PCT/JP2001/006972

Publication Date:

February 27, 2003

Filing Date:

August 13, 2001

Export Citation:

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Assignee:

NAKATA JOSUKE (JP)

International Classes:

H01L25/075; H01L31/0352; H01L31/05; H01L31/054; H01L31/06; H01L31/068; H01L33/00; H01L33/32; H01L33/34; H01L33/44; H01L33/56; H01L33/58; (IPC1-7): H01L31/072; H01L31/103; H01L33/00; H01L29/06

Domestic Patent References:

WO1998015983A1

1998-04-16

Foreign References:

JP2001177132A	2001-06-29
JP2001156315A	2001-06-08
JP2001168369A	2001-06-22
US4691076A	1987-09-01
JPH09162434A	1997-06-20
JP2001102618A	2001-04-13
US5469020A	1995-11-21
JPH0536997A	1993-02-12
JP2000022184A	2000-01-21

Other References: