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Patent Searching and Data


Title:
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2015/166696
Kind Code:
A1
Abstract:
 Provided is a semiconductor module that has a lead frame with which stable wire bonding is possible. In the present invention, a terminal case (1) that is formed by integrally molding lead frames (2) and a case (3) has inner surfaces (6b) in which the lead frames (2) are mounted and step parts (6a) on which a circuit block (11) is fixed, the circuit block (11) having semiconductor chips (13, 14) that are externally formed on an insulating substrate (7). Opening parts (8) are formed between the step parts (6a) and the inner surfaces (6b) to penetrate therebetween, and the opening parts (8) are filled with an adhesive agent (10) to make the insulating substrate (7) adhere to the step parts (6a). Securing a connecting surface to which a bonding wire (16) of one of the lead frames (2) is ultrasonically bonded makes it possible to minimize the incidence of faulty bonding of the lead frames (2).

Inventors:
SATO TADAHIKO (JP)
Application Number:
JP2015/055066
Publication Date:
November 05, 2015
Filing Date:
February 23, 2015
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H01L25/07; H01L23/04; H01L25/18
Domestic Patent References:
WO2014199764A12014-12-18
Foreign References:
JP2004505450A2004-02-19
JP2004134518A2004-04-30
JP2013258321A2013-12-26
JP2006515115A2006-05-18
JP2000500928A2000-01-25
JPH03178151A1991-08-02
Attorney, Agent or Firm:
HATTORI, KIYOSHI (JP)
Kiyoshi Hattori (JP)
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