Title:
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/030165
Kind Code:
A1
Abstract:
This semiconductor module includes a semiconductor element, a metal base, a substrate, and a metal layer. The metal base has a stirring unit. The substrate is positioned between the semiconductor element and the metal base. The metal layer is in contact with the stirring unit, and is positioned between the metal base and the substrate.
Inventors:
IGUCHI TOMOHIRO (JP)
TOMIOKA TAIZO (JP)
TOMIOKA TAIZO (JP)
Application Number:
PCT/JP2017/027238
Publication Date:
February 15, 2018
Filing Date:
July 27, 2017
Export Citation:
Assignee:
TOSHIBA KK (JP)
International Classes:
H01L23/12; B23K20/12; C04B37/02; H01L23/13; H01L23/36; H01L25/07; H01L25/18
Foreign References:
| JP2003179191A | 2003-06-27 | |||
| JP2002248584A | 2002-09-03 | |||
| JP2010194545A | 2010-09-09 | |||
| JP2006224146A | 2006-08-31 | |||
| JP2014179547A | 2014-09-25 | |||
| JP2005028378A | 2005-02-03 | |||
| JP4404052B2 | 2010-01-27 |
Other References:
See also references of EP 3499558A4
Attorney, Agent or Firm:
HYUGAJI, Masahiko (JP)
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