Title:
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/216318
Kind Code:
A1
Abstract:
This semiconductor module is provided with: a base material (10); an alignment mark (M) that is provided on the surface of the base material (10); and a plurality of semiconductor elements (21a, 21b), which are provided on the surface of the base material (10) by being disposed in parallel to the alignment mark (M), and which are separated from each other. Consequently, provided are: the semiconductor module, wherein the alignment mark can be prevented from being peeled and left as a foreign material, and reliability is improved; and a method for manufacturing the semiconductor module.
Inventors:
HIGASHISAKA HIROYOSHI
Application Number:
PCT/JP2018/009646
Publication Date:
November 29, 2018
Filing Date:
March 13, 2018
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H01L21/02; H01L25/065; H01L25/07; H01L25/18; H01L33/48
Foreign References:
| JPH11330604A | 1999-11-30 | |||
| JP2015103541A | 2015-06-04 | |||
| JP2002344028A | 2002-11-29 | |||
| JP2014239157A | 2014-12-18 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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