SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE

WIPO Patent Application WO/2018/211751

A1

Provided are: a semiconductor module in which air bubbles can be prevented from being trapped between a substrate and protrusions, and dielectric breakdown between an insulating substrate and a base sheet can be inhibited; and a power conversion device which includes the semiconductor module. A semiconductor module (101) includes an insulating substrate (1), a semiconductor element (2), a base sheet (3), a case member (4), and a seal resin (5). The semiconductor element (2) is mounted on a side, of the insulating substrate (1), at which one main surface (11a) is present, and the base sheet (3) is joined to a side, of the insulating substrate (1), at which another main surface (11b) is present. The case member (4) is joined to the base sheet (3) so as to surround the insulating substrate (1) and the semiconductor element (2) in a planar view. The seal resin (5) seals the insulating substrate (1) provided in a region surrounded by the base sheet (3) and the case member (4). Protrusions (14) are formed at ends, in a planar view, of the insulating substrate (1) so as to be integrated with the insulating substrate (1) and so as to extend in a direction that intersects with the one main surface (11a).

HARADA KOZO (JP)
HIRAMATSU SEIKI (JP)

PCT/JP2018/004050

November 22, 2018

February 06, 2018

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MITSUBISHI ELECTRIC CORP (JP)

H01L25/07; H01L23/12; H01L23/13; H01L23/24; H01L23/28; H01L23/29; H01L23/31; H01L23/36; H01L25/18; H02M7/48

JPH1187567A	1999-03-30
JP2003100938A	2003-04-04
JPS6151947A	1986-03-14
JPS6442135A	1989-02-14
JPH07131125A	1995-05-19
JPS58153449U	1983-10-14
JP2012009815A	2012-01-12
JP2015195415A	2015-11-05

FUKAMI PATENT OFFICE, P.C. (JP)

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