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Title:
SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/043950
Kind Code:
A1
Abstract:
A semiconductor chip (2) has a surface electrode (3). An electrically conductive joining member (8) is provided above the surface electrode (3), and has first and second joining members (8a, 8b). A lead electrode (9) is joined to a portion of the surface electrode (3) with the first joining member (8a) interposed, and is not in contact with the second joining member (8b). A signal wire (11) is joined to the surface electrode (3). The second joining member (8b) is placed between the first joining member (8a) and the signal wire (11). The thickness of the first joining member (8a) is thicker than the thickness of the second joining member (8b).

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Inventors:
USUI OSAMU (JP)
Application Number:
PCT/JP2017/031807
Publication Date:
March 07, 2019
Filing Date:
September 04, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/60; H01L21/52; H01L23/48
Domestic Patent References:
WO2007119571A12007-10-25
Foreign References:
JP2015126066A2015-07-06
JP2015015395A2015-01-22
Attorney, Agent or Firm:
TAKADA, Mamoru et al. (JP)
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