Title:
SEMICONDUCTOR MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2020/105463
Kind Code:
A1
Abstract:
A semiconductor module 900 comprises: a semiconductor device 300 comprising first and second fin bases 800 comprising first and second connection parts 810 and a resin 850 which seals off outer circumference lateral surfaces of first through fourth conductors 410-413; and a passage forming body 600 which is connected to the first and second connection parts 810 of the first and second fin bases 800. First plastic deformation parts 801 are provided which are plastically deformed such that a thickness direction gap between outer circumference end parts 810a of the first and second connection parts 810 is narrower than a thickness direction gap between intermediate parts 804 of the first and second connection parts 810. A space between the first and second connection parts 810 of the first and second fin bases 800 is filled with the resin 850.
Inventors:
TSUYUNO NOBUTAKE (JP)
MATSUSHITA AKIRA (JP)
KANEKO YUJIRO (JP)
MATSUSHITA AKIRA (JP)
KANEKO YUJIRO (JP)
Application Number:
PCT/JP2019/043801
Publication Date:
May 28, 2020
Filing Date:
November 08, 2019
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H01L23/473; H01L25/07; H01L25/18; H02M7/48
Domestic Patent References:
| WO2019107077A1 | 2019-06-06 |
Foreign References:
| JP2015133402A | 2015-07-23 | |||
| JP2013258334A | 2013-12-26 |
Attorney, Agent or Firm:
TODA Yuji (JP)
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