Title:
SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/245880
Kind Code:
A1
Abstract:
Provided are a semiconductor module and a power conversion device which can be downsized while ensuring connection between a control signal terminal and a control signal electrode of a semiconductor chip. This semiconductor module is provided with: a base member (31); a semiconductor chip (1); a positioning member (6); and a control signal terminal (4). The semiconductor chip (1) is mounted on the base member (31). The semiconductor chip (1) includes a control signal electrode (3). The positioning member (6) includes a positioning part (6a) that touches an outer peripheral end of the semiconductor chip (1). The positioning member (6) is disposed on the base member (31). The control signal terminal (4) is fixed to the positioning member (6). The control signal terminal (4) is connected to the control signal electrode (3).
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Inventors:
YOKOYAMA YOSHINORI (JP)
TANAKA YO (JP)
SODA SHINNOSUKE (JP)
TANAKA YO (JP)
SODA SHINNOSUKE (JP)
Application Number:
PCT/JP2019/022004
Publication Date:
December 10, 2020
Filing Date:
June 03, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/12
Domestic Patent References:
| WO2015045648A1 | 2015-04-02 | |||
| WO2018135465A1 | 2018-07-26 |
Foreign References:
| JP2008210942A | 2008-09-11 | |||
| JP2015041716A | 2015-03-02 | |||
| JP2015008242A | 2015-01-15 | |||
| JP2008205058A | 2008-09-04 | |||
| JP2014146723A | 2014-08-14 | |||
| JP2013143465A | 2013-07-22 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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