Title:
SEMICONDUCTOR MODULE AND POWER CONVERTER
Document Type and Number:
WIPO Patent Application WO/2020/245996
Kind Code:
A1
Abstract:
The present invention enables the achievement of: a semiconductor module having high reliability; and a power converter having high reliability, which uses this semiconductor module. A semiconductor module (100) according to the present invention is provided with a heat dissipation member (7), a semiconductor device (20) and a heat conductive insulating resin sheet (6). The heat conductive insulating resin sheet (6) connects the heat dissipation member (7) and the semiconductor device (20) to each other. The semiconductor device (20) comprises a semiconductor element (1) and a metal wiring member (2a). The metal wiring member (2a) is electrically connected to the semiconductor element (1). The metal wiring member (2a) comprises a terminal part (2aa) that protrudes from the semiconductor device (20) to the outside. A recess (8) is formed outside a region (20aa), to which the heat conductive insulating resin sheet (6) is connected, in a surface portion (20a) of the semiconductor device (20). The recess (8) is positioned in a region that is closer to the heat dissipation member (7) than the terminal part (2aa).
Inventors:
YAMANE TOMOHISA (JP)
TAKI HISAYUKI (JP)
BESSHI NORIYUKI (JP)
MURAMATSU YUYA (JP)
FUKU MASARU (JP)
TAKI HISAYUKI (JP)
BESSHI NORIYUKI (JP)
MURAMATSU YUYA (JP)
FUKU MASARU (JP)
Application Number:
PCT/JP2019/022615
Publication Date:
December 10, 2020
Filing Date:
June 06, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/36; H01L23/28
Domestic Patent References:
| WO2017175612A1 | 2017-10-12 |
Foreign References:
| JP2012004358A | 2012-01-05 | |||
| JPH0661284A | 1994-03-04 | |||
| JP2017022209A | 2017-01-26 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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