Title:
SEMICONDUCTOR MODULE, PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/040313
Kind Code:
A1
Abstract:
A semiconductor chip (40) is bound to one main surface of an insulating substrate (60). A metal base plate (50) is bound to the other main surface of the insulating substrate (60). Subsequently, a resin case is fixed to the peripheral part of the metal base plate (50) in a member containing the semiconductor chip (40). Subsequently, a surface electrode formed on the semiconductor chip (40) is connected to an external connection terminal of the resin case through a bonding wire (81), thereby sealing the semiconductor chip (40). In this manner, a semiconductor device (10) is assembled. In the assembled semiconductor device (10), a solder (31) (32) and a reactive metal foil (30) that acts as a heat source are inserted between the metal base plate (50) and a heat sink (20), the resulting product is pressurized, an electric current is applied to the reactive metal foil (30) to cause ignition to occur, thereby melting the solder (31) (32), and the molten solder (31) (32) is solidified. In this manner, the metal base plate (50) and the heat sink (20) are bound to each other instantly at room temperature.
Inventors:
MOROZUMI, Akira (1-1, Tanabeshinden, Kawasaki-ku, Kawasaki-sh, Kanagawa 56, 〒2100856, JP)
両角 朗 (〒56 神奈川県川崎市川崎区田辺新田１番１号 富士電機ホールディングス株式会社内 Kanagawa, 〒2100856, JP)
両角 朗 (〒56 神奈川県川崎市川崎区田辺新田１番１号 富士電機ホールディングス株式会社内 Kanagawa, 〒2100856, JP)
Application Number:
JP2010/066454
Publication Date:
April 07, 2011
Filing Date:
September 22, 2010
Export Citation:
Assignee:
FUJI ELECTRIC SYSTEMS CO., LTD. (11-2, Osaki 1-chome Shinagawa-k, Tokyo 32, 〒1410032, JP)
富士電機システムズ株式会社 (〒32 東京都品川区大崎一丁目１１番２号 Tokyo, 〒1410032, JP)
MOROZUMI, Akira (1-1, Tanabeshinden, Kawasaki-ku, Kawasaki-sh, Kanagawa 56, 〒2100856, JP)
富士電機システムズ株式会社 (〒32 東京都品川区大崎一丁目１１番２号 Tokyo, 〒1410032, JP)
MOROZUMI, Akira (1-1, Tanabeshinden, Kawasaki-ku, Kawasaki-sh, Kanagawa 56, 〒2100856, JP)
International Classes:
H01L23/373; B23K1/00; B23K3/04; H01L23/36; H05K7/20
Attorney, Agent or Firm:
SAKAI, Akinori (A. SAKAI & ASSOCIATES, 20F Kasumigaseki Building, 2-5, Kasumigaseki 3-chome, Chiyoda-k, Tokyo 20, 〒1006020, JP)