Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2014/122892
Kind Code:
A1
Abstract:
Provided is a highly reliable semiconductor module by suppressing peeling of an epoxy resin from a front surface-side outer circumferential portion of a semiconductor element, said peeling being generated due to long time use and environmental load. The semiconductor module is provided with: a wide band gap semiconductor element (1) mounted on a substrate (6); a carbon-based adhesive layer (2) that is provided on the outer circumferential portion of the wide band gap semiconductor element (1) surface on the reverse side of the surface facing the substrate (6); and a molding resin (3), which is in contact with the carbon-based adhesive layer (2), and which seals the substrate (6) and the wide band gap semiconductor element (1).
Inventors:
FUJITA JUN (JP)
Application Number:
PCT/JP2014/000306
Publication Date:
August 14, 2014
Filing Date:
January 22, 2014
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/29; H01L23/31
Foreign References:
| JPH0383365A | 1991-04-09 | |||
| JPH06177285A | 1994-06-24 | |||
| JPH07122685A | 1995-05-12 | |||
| JPH02106940A | 1990-04-19 | |||
| JPH01171232A | 1989-07-06 | |||
| JP2013008919A | 2013-01-10 | |||
| JPH0669381A | 1994-03-11 | |||
| JP2005011978A | 2005-01-13 | |||
| JPS63207158A | 1988-08-26 | |||
| JPH06333916A | 1994-12-02 |
Attorney, Agent or Firm:
TAKAHASHI, Shogo et al. (JP)
Shogo Takahashi (JP)
Shogo Takahashi (JP)
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