Title:
SEMICONDUCTOR MODULE
Document Type and Number:
WIPO Patent Application WO/2019/077869
Kind Code:
A1
Abstract:
This semiconductor module is provided with: four switching elements (700H, 700L, 701H, 701L) that constitute upper and lower arms for two phases; a drive unit (80) for the four switching elements; a plurality of islands (610 to 614) in which the four switching elements and the drive unit are arranged; a sealing resin body (50) which integrally seals the four switching elements and the drive unit; and output terminals (63P1, 63P2) which are respectively continuous with the islands on the lower-arm side, and which protrude from the sealing resin body. The two switching elements on the lower-arm side are axi-symmetrically arranged with respect to the drive unit. The two switching elements on the upper-arm side are axi-symmetrically arranged with respect to the drive unit. A distance between the two switching elements on the lower-arm side is longer than a distance between the two switching elements on the upper-arm side.
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Inventors:
NAKAMURA TETSUYA (JP)
NISHIHATA MASAYOSHI (JP)
MASUMOTO YUSUKE (JP)
NISHIHATA MASAYOSHI (JP)
MASUMOTO YUSUKE (JP)
Application Number:
PCT/JP2018/031106
Publication Date:
April 25, 2019
Filing Date:
August 23, 2018
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L25/07; H01L23/29; H01L23/48; H01L25/18
Foreign References:
| JP2014093373A | 2014-05-19 | |||
| US20130256807A1 | 2013-10-03 | |||
| US20010045627A1 | 2001-11-29 | |||
| JP2015106685A | 2015-06-08 | |||
| JP2001332687A | 2001-11-30 | |||
| JP2015002185A | 2015-01-05 |
Attorney, Agent or Firm:
JIN Shunji (JP)
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